Today at a forum in Taiwan, Samsung announced new high-performance embedded NAND flash chips for smartphones, dubbed “moviNAND.” The chips are available in 8GB and 16GB modules and enable more efficient processing. They are also the first to be fully compatible with the new high-performance e-MMC v4.41 industry specification.
At the same time, Samsung introduced ultra-thin five chip MCP (multi-chip package) storage that measures just 1mm thick compared to the current four-chip MCPs, which are 1.15mm high. The moviNAND-based MCP will arrive at the same time as the new flash.
The 8GB moviNAND flash based on 30nm-class, 32-gigabit NAND flash chips began production in late July, with the 16GB moviNAND, 20nm-class, 32Gb NAND flash arriving later in September. Current 30nm-class 32Gb NAND flash chips will be gradually replaced with a full line of 20nm-class 32Gb NAND chips for future moviNAND products later in 2010.
