Posts tagged as: NAND

Micron’s 3D QLC NAND Flash Memory May Lead to Larger SSDs

Micron is planning to launch a line of solid state drives based on three-dimensional (3D) quadruple-level cell (QLC) flash memory, similar to what Toshiba announced last June. While initial products will take aim at the enterprise sector, and in particular datacenters that rely on 7,200 RPM hard drives, according to The Register, it’s only a matter of […]

Silicon Motion Dubets the SATA FerriSSD Single-chip 3D NAND SSD

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today announced that it has extended its popular family of SATA 6 Gb/s FerriSSD Industrial BGA SSDs to support the latest 3D NAND with end-to-end data path protection, NANDXtend ECC, and IntelligentScan feature – delivering unsurpassed data […]

After Five-Year Hiatus, Samsung to Supply Apple with NAND Flash Memory in 2017

Samsung is once again set to begin supplying Apple with NAND flash memory chips in 2017, ending a five-year hiatus dating back to the debut of the iPhone 5 in 2012, according to ETNews. The reason for the dissolution of the original supplier relationship is given as Samsung’s unwillingness to comply with Apple’s electromagnetic interference […]

Intel Demos Optane (3D XPoint) In A Backup Device At IDF Shenzhen

Rob Crooke, Intel VP for Non-Volatile Memory Solutions Group (NSG), joined Ian Yang, President of Intel China, on stage to talk about Optane technology and perform the first public demonstration. Optane, also known as 3D XPoint, promises DRAM-like performance with flash-like data storage retention. Once implemented, Optane will turn your computer into an instant booting […]

Intel Returns to Memory Manufacturing – Future of IMFT Unknown

Rob Crooke, Senior Vice President and General Manager of the Non-Volatile Memory Solutions Group at Intel, penned a blog post that defines a tectonic shift in Intel’s future non-volatile memory strategy. Intel is expanding its Dalian fab, which has been in operation since 2010, to produce its new 3D NAND and the revolutionary 3D XPoint. […]

Toshiba Launches Three New NVMe SSD Lines

Toshiba announced three new PCIe SSDs featuring the NVMe interface at Flash Memory Summit 2015. The NVMe interface is a lightweight register and command set designed specifically for non-volatile memories, which provides high performance and low latency. Toshiba’s latest products run the gamut from enterprise to client applications and utilize a new Toshiba controller platform […]

Toshiba, SanDisk Announce 48-Layer 3D BiCS TLC NAND

Toshiba and SanDisk’s Flash Forward partnership is ready to populate the newly constructed Fab 5 in Yokkaichi, Japan. Both companies announced new 3bit-per cell (X3) Bit Cost Scaling (BiCS) Flash with 48-layers on an unknown lithography process node. Flash Forward plans to follow Samsung with Charge Trap technology, which holds up to eight charge levels […]

Intel and Micron Announce New Breed of Memory Chip – 3D XPoint

  Intel and Micron have designed a new class of memory chip that could radically improve the performance of smartphones, desktops, laptops, and other computing devices. Revealed during a press event in San Francisco on Tuesday morning, the technology is called 3D XPoint. According to Intel and Micron, these chips are “non-volatile,” meaning they can […]

Samsung Shows Off 3D Vertical NAND Flash Tech – Boosts Density, Speed

Samsung has debuted the industry’s first 3D vertical NAND flash memory architecture. Just as Intel has pushed processor technology with its 3D tri-gate architecture first seen on its ‘Ivy Bridge’ designs, Samsung’s engineers have taken a vertical to boost performance applying a similar principle to the way it designs its next-generation NAND flash designs. According […]

CEO of OCZ Technology Group Says NAND Memory Supply Shortage Will Hurt Sales

The CEO of OCZ Technology Group, a solid state drive manufacturer, announced last week that the company would not be able to produce enough of its products to meet industry demand. As EE Times reports, the shortage in NAND components — the chips that allow for smartphones and mobile devices to have high-density, low-power internal […]

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