Intel World’s Smallest HSPA+ Solution for 3G Smart Phones

Posted by at 11:06 am on February 14, 2011

Intel on Monday announced it began shipping its XMM 6260 platform to key partners. It support HSPA+ networks for download speeds of up to 21Mbps and upload speeds as high as 11.5Mbps.
The platform is also said to use less power than similar products from competitors, specifically ARM. It was earlier tied to an upcoming MeeGo-powered handset and can be used in USB modems, Intel says.

The XMM 6260 platform is based on the X-GOLD 626 baseband processor, manufactured by TSMC in leading-edge 40nm process technology. The X-GOLD 626 integrates a power management unit, enabling world-class power consumption in both active and idle mode. The processor is combined with the SMARTi UE2 RF transceiver. Leveraging from a power-saving 65nm CMOS technology the transceiver uses a unique digital architecture that significantly reduces the number of power amplifiers and RF components, resulting in reduced board space and power consumption. The XMM 6260 smart phone modem platform enables HSPA+ designs in less than 600mm2 PCB (Printed Circuit Board) area, making them among the smallest comparable solutions worldwide.

At the same time, the multimode XMM 7060 platform will support 2G, 3G and LTE networks. It is paired with the X-GOLD 706 multimode baseband processor and the SMARTi 4G multimode RF transceiver. The low-power and slim modem will be capable of serving up to five LTE bands, five 3G and four 2G bands at the same time.

Samples of this chip will ship in the summer, with volume shipments arriving during the second half of 2012. Both chips will be shown off at the currently ongoing MWC exhibition in Spain, likely in a handset with the Medfield processor.

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