At the Global Foundries Technology Conference, AMD’s CTO Mark Papermaster announced that the company will be transitioning “graphics and client products” from the Global Foundries 14nm LPP FinFET process it uses now to the new 12nm LP process in 2018. Global Foundries also announced that 12LP will begin production in 1Q18.
Previously, AMD has implied that Zen 2 will use the 7nm process. The company has used both “Zen+” and “Zen 2” to refer to its next-generation die.
The transition to 12nm LP also reaffirms AMD’s commitment to its partnership with Global Foundries. The companies signed a five-year wafer supply agreement recently, but there has been speculation that AMD might seek other partners for its forthcoming product generations.
